Bosch to build €1 billion autonomous vehicle chip plant
2018-04-25 15:40:42 [Print]
Bosch, the world's largest supplier of automotive parts, has announced plans to build a €1 billion ($1.1 billion) semiconductor plant, focused on self-driving cars, smart homes, and smart city infrastructure.
"Semiconductors are a key technology for the connected world," said Bosch Board Member Jens Fabrowsky. "No car could drive today without semiconductors." Dresden offers a unique microelectronics cluster, said Bosch. In the future, the company wants to cooperate closely with the locally based semiconductor companies and universities.
The factory will be located in Dresden, Germany and should be ready by 2021. 300-millimeter technology is used in Dresden for wafer production. Later, up to 700 people will work in the factory.
Bosch chip manufacturing capabilities
Bosch is currently able to produce chip products: ECU controller chip, acceleration, speed, mass flow, pressure, and ambient temperature sensors, etc. Bosch has more than 1,000 patents in chip manufacturing.
In 1973, Bosch began to develop the core component of the automotive components and control system - chips. In 1998, Bosch successfully developed micro-electromechanical systems (MEMS) processing technology. So far, Bosch already has a fully automated manufacturing process based on 300mm wafer semiconductors with a minimum process length of 65nm.
Today, Bosch is fully equipped with R&D and manufacturing capabilities for the integration of chips, electromechanical products and software, which is the only one with this capability in the world. As Bosch executive Jens Fabrowsky said, Semiconductors are a key technology for the connected world. Bosch has taken the lead to pick up this key and is ready to open the door to the Internet of Things and the Internet of Everything.
"Semiconductors are a key technology for the connected world," said Bosch Board Member Jens Fabrowsky. "No car could drive today without semiconductors." Dresden offers a unique microelectronics cluster, said Bosch. In the future, the company wants to cooperate closely with the locally based semiconductor companies and universities.
The factory will be located in Dresden, Germany and should be ready by 2021. 300-millimeter technology is used in Dresden for wafer production. Later, up to 700 people will work in the factory.
Bosch chip manufacturing capabilities
Bosch is currently able to produce chip products: ECU controller chip, acceleration, speed, mass flow, pressure, and ambient temperature sensors, etc. Bosch has more than 1,000 patents in chip manufacturing.
In 1973, Bosch began to develop the core component of the automotive components and control system - chips. In 1998, Bosch successfully developed micro-electromechanical systems (MEMS) processing technology. So far, Bosch already has a fully automated manufacturing process based on 300mm wafer semiconductors with a minimum process length of 65nm.
Today, Bosch is fully equipped with R&D and manufacturing capabilities for the integration of chips, electromechanical products and software, which is the only one with this capability in the world. As Bosch executive Jens Fabrowsky said, Semiconductors are a key technology for the connected world. Bosch has taken the lead to pick up this key and is ready to open the door to the Internet of Things and the Internet of Everything.
