Grinm Advanced Materials to invest in sputtering target phase II expansion project
2026-07-31 14:22:02 [Print]
Grinm Advanced Materials Co., Ltd. announced on July 30 that it plans to launch a phase II expansion project for high purity sputtering targets used in integrated circuits. The project, with an estimated investment of RMB486 million (USD72.02 million), is scheduled to break ground in September 2026, begin production in September 2027, and reach full investment completion by December 2028.
The expansion will add 30,000 units of annual production capacity for high purity copper and copper alloy, tantalum, and titanium targets. This significant capacity boost is expected to raise the domestic substitution rate for advanced sputtering targets, overcome technical bottlenecks in target fabrication for sub 7nm process nodes, and fill the gap in China's supply of high end products in this critical semiconductor materials segment.
The expansion will add 30,000 units of annual production capacity for high purity copper and copper alloy, tantalum, and titanium targets. This significant capacity boost is expected to raise the domestic substitution rate for advanced sputtering targets, overcome technical bottlenecks in target fabrication for sub 7nm process nodes, and fill the gap in China's supply of high end products in this critical semiconductor materials segment.
Tantalum Pentoxide 99.99%min EXW China
Unit:RMB/kg
China tantalum metal producers' suspension number statistics by province by month
Unit: pcs
