Defu Technology plans private placement to fund copper foil projects
2025-09-17 16:17:39 [Print]
Jiujiang Defu Technology Co., Ltd. plans to raise up to RMB1.93 billion (USD272 million) through a private placement, and the net proceeds will be used for the acquisition of 100% equity in Circuit Foil Luxembourg S.a.r.l., the development of an electronic chemicals project for copper foil additives, as well as to supplement working capital.
Circuit Foil Luxembourg specializes in the R&D, production, and sales of high-end copper foils for electronic circuits. Its core products, HVLP and DTH, are widely used in advanced applications. It is the only non-Japanese industry leader worldwide with independent mastery of core technologies and large-scale production capacity in this field, holding a leading market share. Upon completion of the deal, Defu Technology will own 100% of the company.
In addition, part of the raised funds will be invested in upstream electronic chemicals for copper foil additives. By securing its own supply of key raw materials, Defu Technology aims to improve production stability, lower costs, and strengthen its integrated competitive edge.
Circuit Foil Luxembourg specializes in the R&D, production, and sales of high-end copper foils for electronic circuits. Its core products, HVLP and DTH, are widely used in advanced applications. It is the only non-Japanese industry leader worldwide with independent mastery of core technologies and large-scale production capacity in this field, holding a leading market share. Upon completion of the deal, Defu Technology will own 100% of the company.
In addition, part of the raised funds will be invested in upstream electronic chemicals for copper foil additives. By securing its own supply of key raw materials, Defu Technology aims to improve production stability, lower costs, and strengthen its integrated competitive edge.
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