Xianglu Tungsten to raise no more than RMB766 million via private placement
2022-08-10 12:00:28
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On August 9, Xianglu Tungsten announced that it planned to raise no more than RMB766 million (USD113 million) via private placement for its technical upgrading project related to relocation in local industrial park, photovoltaic-purpose ultra-thin tungsten wire project, and high-performance cutting tool surface-coating project and to supplement working capital.
.Asian Metal CopyrightOn August 9, Xianglu Tungsten announced that it planned to raise no more than RMB766 million USD113 million via private placement for its technical upgrading project related to relocation in local industrial park, photovoltaic-purpose ultra-thin tungsten wire project, and high-performance cutting tool surface-coating project and to supplement working capitalAsian Metal Copyright
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