Tongling Nonferrous' ultra-thin electronic copper foil project phase II starts construction
2021-05-26 16:43:14 [Print]
On May 20, the second phase of the project of 20,000tpy high-precision ultra-thin electronic copper foil for energy storage of Tongling Nonferrous officially started construction.
The project, with a total investment of 820 million yuan (128 million US dollars) and an annual production capacity of 10,000t, covers an area of 40mu and mainly produces 5G high-frequency and high-speed printed circuit board, rigid copper clad laminate, metal substrate and other electronic copper foil products. It is expected to enter the commissioning stage by the end of 2022. After the project is completed and put into commercial production, Tongling Nonferrous will have an annual production capacity of 55,000t of various high-precision electronic copper foils.
The project, with a total investment of 820 million yuan (128 million US dollars) and an annual production capacity of 10,000t, covers an area of 40mu and mainly produces 5G high-frequency and high-speed printed circuit board, rigid copper clad laminate, metal substrate and other electronic copper foil products. It is expected to enter the commissioning stage by the end of 2022. After the project is completed and put into commercial production, Tongling Nonferrous will have an annual production capacity of 55,000t of various high-precision electronic copper foils.
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