Dagang Corporation to invest RMB424 million in TSV wafer packaging project of 12-inch CIS chips
2022-08-24 18:07:43
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Dagang Corporation announced on August 23 that its sub-subsidiary, Suzhou Keyang Semiconductor Co.Asian Metal Copyright, intends to invest about RMB424 million USD62 million in total in a TSV wafer packaging project of 12-inch CIS chips, with a production capacity of 6,000 pieces per month.Asian Metal Copyright, Ltd.Asian Metal CopyrightDagang Corporation announced on August 23 that its sub-subsidiary, Suzhou Keyang Semiconductor Co.Asian Metal Copyright, intends to invest about RMB424 million (USD62 million) in total in a TSV wafer packaging project of 12-inch CIS chips, with a production capacity of 6,000 pieces per month.
.Asian Metal Copyright, LtdAsian Metal Copyright
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