First phase of Yangjie Technology's integrated circuit and power semiconductor assembly and test project goes into operation
2021-06-29 17:05:09 [Print]
On June 28, the commissioning ceremony of the first phase of Yangjie Technology's (Yangzhou Yangjie Electronic Technology Co., Ltd.) integrated circuit and power semiconductor assembly and test project was held.
With a total investment of RMB3 billion (USD465 million), a cover area of 65.89 acres and a total construction area of about 280,000 square meters, the project is mainly engaged in the research and development, production and sales of power devices and integrated circuit assembly and test. In particular, with a construction area of about 120,000 square meters, the first phase plans to invest RMB1.38 billion (USD214 million), and mainly constructs ultra-thin micro-power semiconductor chip assembly and test for smart terminals as well as supporting facilities. It is estimated that the second phase will invest RMB1.62 billion (USD251 million), and the construction area will reach about 160,000 square meters.
With a total investment of RMB3 billion (USD465 million), a cover area of 65.89 acres and a total construction area of about 280,000 square meters, the project is mainly engaged in the research and development, production and sales of power devices and integrated circuit assembly and test. In particular, with a construction area of about 120,000 square meters, the first phase plans to invest RMB1.38 billion (USD214 million), and mainly constructs ultra-thin micro-power semiconductor chip assembly and test for smart terminals as well as supporting facilities. It is estimated that the second phase will invest RMB1.62 billion (USD251 million), and the construction area will reach about 160,000 square meters.
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