Jilin Sino-microelectronics starts building its semiconductor project
2021-06-01 17:43:25 [Print]
Recently, the advanced power device packaging base project of Jilin Sino-microelectronics Co., Ltd. started construction.
It is reported that the project extends the industrial chain of semiconductor power devices, with a total investment of RMB2 billion (USD0.22 billion), a total floor area of 110,000 square meters and a building area of 66,000 square meters. The project has an annual output of 1.5 billion advanced power devices and module packaging, and the products are used in industrial power supply, 5G communication, photovoltaic power generation, automotive electronics and other strategic emerging and new infrastructure supporting fields.
It is reported that the project extends the industrial chain of semiconductor power devices, with a total investment of RMB2 billion (USD0.22 billion), a total floor area of 110,000 square meters and a building area of 66,000 square meters. The project has an annual output of 1.5 billion advanced power devices and module packaging, and the products are used in industrial power supply, 5G communication, photovoltaic power generation, automotive electronics and other strategic emerging and new infrastructure supporting fields.
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