12-inch silicon wafer industrialization project for integrated circuits set up in Dezhou
2019-12-20 17:17:50 [Print]
On December 18, Dezhou municipal government and General Research Institute for Nonferrous Metals, RS Technologies Co., Ltd., and Dezhou Huida Semiconductor Equity Investment Fund Co., Ltd. signed a cooperation agreement on the industrialization of 12-inch silicon wafers for integrated circuits.
The 12-inch silicon wafer is the key basic material for high-end chip applications in 5G communications, artificial intelligence, big data, Internet of things and other fields. With a total investment of RMB6.2 billion (USD884.63 million), the project is expected to produce 3.6 million pieces of 12-inch silicon wafers annually. After the project is put into production, China will no longer entirely rely on importing 12-inch silicon material for integrated circuits.
The 12-inch silicon wafer is the key basic material for high-end chip applications in 5G communications, artificial intelligence, big data, Internet of things and other fields. With a total investment of RMB6.2 billion (USD884.63 million), the project is expected to produce 3.6 million pieces of 12-inch silicon wafers annually. After the project is put into production, China will no longer entirely rely on importing 12-inch silicon material for integrated circuits.
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