Silan Microelectronics to raise no more than RMB6.5 billion for construction of automobile semiconductor production lines

On October 14, Silan Microelectronics announced that the company planned to issue no more than 283 million shares in a non-public way, with a total amount of raised capital of no more than RMB6.Asian Metal Copyright The net proceeds after deducting the issuance expenses are planned to invest in the production line project with an annual output of 360,000 12-inch chips, the construction project of SiC power device production line, the automobile semiconductor packaging project Phase I and the supplementing of working capital.Asian Metal Copyright5 billion (USD903 million).Asian Metal CopyrightOn October 14, Silan Microelectronics announced that the company planned to issue no more than 283 million shares in a non-public way, with a total amount of raised capital of no more than RMB6.Asian Metal Copyright The net proceeds after deducting the issuance expenses are planned to invest in the production line project with an annual output of 360,000 12-inch chips, the construction project of SiC power device production line, the automobile semiconductor packaging project (Phase I) and the supplementing of working capital.
.Asian Metal Copyright The net proceeds after deducting the issuance expenses are planned to invest in the production line project with an annual output of 360,000 12-inch chips, the construction project of SiC power device production line, the automobile semiconductor packaging project Phase I and the supplementing of working capitalAsian Metal Copyright