JSG's silicon carbide substrate wafer project of RMB5 billion settled down in Yinchuan
2022-03-01 15:31:30 [Print]
Recently, Yinchuan held the centralized signing and government-bank-enterprise matchmaking meeting for projects in the first quarter of 2022. 52 investment promotion projects were signed during the meeting, with a total investment of RMB45.6 billion (USD7.22 billion).
Of the above signed projects, the silicon carbide substrate wafer project invested by JSG was settled down in Ningxia. With a total investment of RMB5 billion (USD792.19 million), the project will be built in two phases. The phase one project, which has a total investment of RMB3.36 billion (USD532.35 million), is expected to commence building in March and produce 400,000 six-inch silicon carbide wafers per year with annual operating incomes of RMB2.4 billion (USD380.25 million) and annual taxes of RMB280 million (USD44.36 million) after realizing the designed production capacity.
Of the above signed projects, the silicon carbide substrate wafer project invested by JSG was settled down in Ningxia. With a total investment of RMB5 billion (USD792.19 million), the project will be built in two phases. The phase one project, which has a total investment of RMB3.36 billion (USD532.35 million), is expected to commence building in March and produce 400,000 six-inch silicon carbide wafers per year with annual operating incomes of RMB2.4 billion (USD380.25 million) and annual taxes of RMB280 million (USD44.36 million) after realizing the designed production capacity.
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