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  • SJ Semiconductor signs contract for 12-inch silicon wafer manufacturing project in Jiangyin

    2022-01-25 18:04:12   [Print]
    On January 20, 2022, SJ Semiconductor Co.Asian Metal Copyright signed an investment agreement with Jiangyin Government and Jiangyin High-Tech Industrial Development Zone Management Committee on the 12-inch silicon wafer manufacturing and three-dimensional multi-chip integrated packaging project.Asian Metal Copyright, Ltd.Asian Metal Copyright6 billion about RMB10.Asian Metal Copyright signed an investment agreement with Jiangyin Government and Jiangyin High-Tech Industrial Development Zone Management Committee on the 12-inch silicon wafer manufacturing and three-dimensional multi-chip integrated packaging project.

    The total investment for the contracted project is $1.6 billion (about RMB10.Asian Metal Copyright6 billion about RMB10.Asian Metal Copyright142 billion yuan), with the registered capital increased to $830 million.Asian Metal Copyright6 billion about RMB10.Asian Metal Copyright The construction of the plant (the second phase) would be started in February 2022.

    The project will have a monthly capacity of 120,000 wafer level packaging and 20,000 chip integrated processing to meet the needs for advanced packaging of booming 5G, AI, HPC, IOT, automotive electronics and other areas.


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    China silicon metal producers' sales to production ratio statistics by province by month
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