BWIC expects to put GaAs semiconductor project into mass production in 2021
2020-05-22 14:34:13 [Print]
Being under the acceptance check of workshops, BW38 IC Manufacturing Co., Ltd. (BWIC) expects to put the GaAs semiconductor project into operation in mid-2021 and put it into mass production at the end of 2021.
Jiang Jian, General Manager of BWIC, stated that the project can produce the RF module chips for over 300 million mobile phones after reaching designed production capacity, if all chips are used to produce mobile phones.
Founded in 2018, BWIC is a professional wafer OEM of six-inch GaAs compound semiconductor IC chips. The company's newly-built six-inch GaAs IC production line is managed and operated by a team with rich compound semiconductor production and research experience consisting of Chinese and Japanese members.
Jiang Jian, General Manager of BWIC, stated that the project can produce the RF module chips for over 300 million mobile phones after reaching designed production capacity, if all chips are used to produce mobile phones.
Founded in 2018, BWIC is a professional wafer OEM of six-inch GaAs compound semiconductor IC chips. The company's newly-built six-inch GaAs IC production line is managed and operated by a team with rich compound semiconductor production and research experience consisting of Chinese and Japanese members.
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