Hunan Jiangfeng Electronic Materials starts construction of semiconductor materials project
2020-04-28 12:13:23 [Print]
On 26 April, Hunan Jiangfeng Electronic Materials Co
Located in Henglong New Area, Heshan District, the project with a planned investment of RMB500 million (USD70.61 million) will further break through the industrial chain of chip materials to provide basic materials for Chinese semiconductor chip and display panel industries.
. , Ltd . held groundbreaking ceremony for its 800-ton-per-annum ultra-high-purity metal materials production project. Located in Henglong New Area, Heshan District, the project with a planned investment of RMB500 million (USD70.61 million) will further break through the industrial chain of chip materials to provide basic materials for Chinese semiconductor chip and display panel industries.