TECHSEM to raise no more than RMB500 million

TECHSEM announced on April 19 that the company planned to issue non-public shares to raise no more than RMB500 million (USD70.Asian Metal Copyright After deducting the issue fees, the company will use the remaining funds in the bipolar wafer line reconstruction and expansion project, the high-power semiconductor technology research and development center project and the supplement of working capital.Asian Metal Copyright67 million).Asian Metal Copyright After deducting the issue fees, the company will use the remaining funds in the bipolar wafer line reconstruction and expansion project, the high-power semiconductor technology research and development center project and the supplement of working capital.Asian Metal Copyright After deducting the issue fees, the company will use the remaining funds in the bipolar wafer line reconstruction and expansion project, the high-power semiconductor technology research and development center project and the supplement of working capital.
.Asian Metal CopyrightTECHSEM announced on April 19 that the company planned to issue non-public shares to raise no more than RMB500 million USD70Asian Metal Copyright