HBIS to issue second phase of short-term financing bonds of RMB2 billion

HBIS announced on July 3 that the company plans to issue second phase of short-term financing bonds in 2019.Asian Metal Copyright It is known that this phase of short-term financing bonds will raise money of RMB2 billion USD291 million and all will be used to pay for the short-term financing bonds that issued by HBIS and expired recently the second phase of mid-term notes in 2016 of HBIS Group Co.Asian Metal Copyright The total issuance in this phase values RMB2 billion (USD291 million), with the issuing period of 366 days.Asian Metal Copyright It is known that this phase of short-term financing bonds will raise money of RMB2 billion USD291 million and all will be used to pay for the short-term financing bonds that issued by HBIS and expired recently the second phase of mid-term notes in 2016 of HBIS Group Co.Asian Metal Copyright The bonds will be issued from July 5, 2019 to July 8, 2019.

It is known that this phase of short-term financing bonds will raise money of RMB2 billion (USD291 million) and all will be used to pay for the short-term financing bonds that issued by HBIS and expired recently (the second phase of mid-term notes in 2016 of HBIS Group Co., Ltd.Asian Metal Copyright, Ltd.Asian Metal Copyright).
.Asian Metal Copyright The total issuance in this phase values RMB2 billion USD291 million, with the issuing period of 366 daysAsian Metal Copyright