China Wafer Level CSP to invest RMB410 million in building semiconductor science and innovation industry ecological park project

On October 30, China Wafer Level CSP announced that the company planned to implement the construction project of "Semiconductor Science and Innovation Industrial Eco Park" on its own business plot, with a total investment scale of RMB410 million (USD56.Asian Metal Copyright54 million; the project will provide effective productive resources and industrial support for the further production scale expansion of the company's vehicle-level micro optical device project as well as the industrial chain layout of the vehicle-level GaN inverter project.Asian Metal Copyright54 million); the project will provide effective productive resources and industrial support for the further production scale expansion of the company's vehicle-level micro optical device project as well as the industrial chain layout of the vehicle-level GaN inverter project.
.Asian Metal Copyright54 million; the project will provide effective productive resources and industrial support for the further production scale expansion of the company's vehicle-level micro optical device project as well as the industrial chain layout of the vehicle-level GaN inverter projectAsian Metal Copyright