Infineon to invest EUR2 billion in Kulim frontend wafer fab
2022-02-21 12:00:30 [Print]
Germany-based Infineon Technologies recently announced that it plans to add significant manufacturing capacities in the field of wide bandgap (SiC and GaN) semiconductors.
The company has announced that it is investing more than EUR2 billion to build a third module at its site in Kulim, Malaysia. Once fully equipped, the module will generate EUR2 billion in additional annual revenue with products based on silicon carbide and gallium nitride.
Construction of Kulim 3 will begin in June and the fab will be ready for equipment in summer 2024. The first wafers will leave the fab in the second half of 2024.
The company has announced that it is investing more than EUR2 billion to build a third module at its site in Kulim, Malaysia. Once fully equipped, the module will generate EUR2 billion in additional annual revenue with products based on silicon carbide and gallium nitride.
Construction of Kulim 3 will begin in June and the fab will be ready for equipment in summer 2024. The first wafers will leave the fab in the second half of 2024.
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