Roshow Technology to raise no more than RMB2.94 billion for projects including third-generation power semiconductor

Roshow Technology disclosed a non-public share offering plan on November 23.Asian Metal Copyright94 billion USD460 million.Asian Metal Copyright The target of this issuance is no more than 35 specific objects that meet the prescribed conditions, and the total amount of funds raised is no more than RMB2.Asian Metal Copyright After deducting the issuance cost, the fund will be used for the "third-generation power semiconductor silicon carbide industrial park project", "large-size silicon carbide substrate RD center project" and working capital's supplementing.Asian Metal Copyright94 billion (USD460 million).Asian Metal Copyright After deducting the issuance cost, the fund will be used for the "third-generation power semiconductor silicon carbide industrial park project", "large-size silicon carbide substrate RD center project" and working capital's supplementing.Asian Metal Copyright After deducting the issuance cost, the fund will be used for the "third-generation power semiconductor (silicon carbide) industrial park project", "large-size silicon carbide substrate R&D center project" and working capital's supplementing.
.Asian Metal Copyright94 billion USD460 millionAsian Metal Copyright