KINGSEMI to raise no more than RMB1 billion via private placement
2021-06-15 15:19:48 [Print]
KINGSEMI announced that it plans to raise no more than RMB1 billion (USD0
. 16 billion) via private placement for its Shanghai Lin'gang-based R&D and industrialization project, and high-end silicon wafer treatment equipment industrialization project (phase two) and to supplement working capital.